Integrated Microchannel Heat Exchanger
- Hangzhou Shenshi Energy Conservation Technology Co., Ltd.
- product brand:HZSS
- Numéro de stand：A4M32N3E49
- product specification:
- product category:Refrigeration Equipment-Components for refrigerating systems and plants-Miscellaneous components for refrigerating systems and plants
- product introduction:The bonding is closely attached and held at a certain temperature and pressure for a period of time, so that the atoms between the contact faces are mutually diffused to form a joint. The main factors affecting the diffusion bonding process and joint quality are temperature pressure diffusion time and surface roughness. The higher the soldering temperature, the faster the atom diffusion, and the soldering temperature is generally 0.5-0.8 times the melting point of the material. Vacuum diffusion bonding is the most widely used. The diffusion connection pressure is small, the workpiece does not produce macroscopic deformation, and the strength and performance of the joint for diffusion bonding are the same as those the base material.
